TriEye
Component
CMOS-fabricated short-wave-infrared (SWIR) sensing chips that let machine vision see through rain, fog, dust and darkness at mass-market cost.
TriEye (Tel Aviv) commercialises short-wave infrared (SWIR) sensing for mass-market machine vision. Its core claim is replacing expensive InGaAs SWIR sensors with a proprietary CMOS-compatible design fabricated at a leading global foundry, which it says cuts SWIR sensor cost by up to 100x while delivering imaging plus deterministic 3D ranging in rain, fog, glare, dust and low light. The sensor stack targets automotive ADAS and autonomy, industrial machine vision and mobility, letting vision systems add a beyond-visible spectral layer without repricing the bill of materials. Investors include Porsche Ventures, Intel Capital, Samsung Ventures, Grove Ventures, Discount Capital and the UAE's Strategic Development Fund (trieye.tech; Times of Israel, 2023).
Research mapping
Physical AI / Perception & Sensing (L7) / Component
Evidence boundary
Original analysis and independent corroboration remain under development. Commercial scale and durable technical advantage remain under review.
What makes it defensible
TriEye's patent-pending semiconductor design makes SWIR cameras manufacturable on standard CMOS at a fraction of InGaAs cost - the cost curve, not the physics, is what has kept SWIR out of mass-market machine vision.
Position in the stack: Sensor chip designer selling to automotive Tier 1s/OEMs and industrial vision integrators, who own the camera module and vehicle qualification. The defensible position is the device design plus foundry process transfer; it competes with InGaAs incumbents on cost and with active-illumination approaches on range.
Who buys it
Named customers: Porsche, Continental, DENSO, Trimble
Founding team
Avi Bakal — CEO and Co-founder — Co-founded TriEye in 2017; leads the company's automotive and industrial SWIR commercialisation.
Omer Kapach — VP R&D and Co-founder — Co-founded TriEye in 2017; leads sensor and chip development.
Prof. Uriel Levy — CTO and Co-founder — Built the underlying technology over nearly a decade of nanophotonics research at the Hebrew University of Jerusalem.
SourceFinancing detail
- Last round
- Series C
Investors: Intel Capital, Porsche Ventures, Samsung Ventures, M&G Investments, Varana Capital, Grove Ventures
Mapped funds and investors
Direct relationships supported by published evidence.
Reported holdings as-of
No sourced relationships mapped yet.
Disclosed investment history
No sourced relationships mapped yet.
Showing up to four relationships in each group. ETF weights describe the fund’s portfolio, not ownership of this company. Private investment history does not establish current ownership.