Private companySeries B

EnCharge AI

Component

encharge.ai

Analog in-memory computing AI accelerators that cut inference power, cost and CO2 versus GPUs.

EnCharge AI builds analog in-memory computing accelerators - chips that compute where the memory lives instead of shuttling data between memory and processor. The company reports 20x higher efficiency (TOPS/W), 9x higher compute density (TOPS/mm2), 10x lower total cost per inference and about 100x lower CO2 emissions versus cloud, measured on silicon against industry-leading products, plus 350M+ chips shipped and 150+ patents granted (all company-reported). The core technology came out of six years of Princeton University research initially funded by DARPA and the U.S. Department of Defense, and is designed to drop into the existing semiconductor supply chain as chiplets, ASICs or standard PCIe cards with an end-to-end programmable software stack. EnCharge closed an oversubscribed $100M Series B in February 2025, bringing total funding past $144M.

Research mapping

Physical AI / Edge Compute & Control Silicon (L5) / Component

Evidence boundary

Original analysis and independent corroboration remain under development. Commercial scale and durable technical advantage remain under review.

Charge-based analog in-memory compute silicon with 150+ granted patents and DARPA/DoD lineage - the efficiency edge comes from device physics, not just chip architecture.

Component supplier of AI accelerators that sit inside edge and cloud systems. Defensibility comes from an in-memory computing macro that is difficult to replicate and a patent portfolio validated through U.S. government research programmes.

Industrial Automation — OEMsGovernment — Program Buyers

Naveen Verma — Co-founder and CEO — Professor of electrical and computer engineering at Princeton University since 2009; spent six years leading the research behind EnCharge's core technology before co-founding the company

Kailash Gopalakrishnan — Co-founder and CTO — Former IBM Fellow who led worldwide efforts on advanced AI hardware, software and algorithmic co-design at IBM

Echere Iroaga — Co-founder and COO — 25+ years in semiconductor design and management; previously VP/GM of MACOM's connectivity business unit and founder of Renovus Inc.

Source
Last round
Series B

Mapped funds and investors

Direct relationships supported by published evidence.

Reported holdings as-of

No sourced relationships mapped yet.

Disclosed investment history

No sourced relationships mapped yet.

Showing up to four relationships in each group. ETF weights describe the fund’s portfolio, not ownership of this company. Private investment history does not establish current ownership.

  1. Financing

    Series B — $144,000,000 total disclosed

    Source
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